Non-invasive quantitative multilayer assessment method and resulting multilayer component

ABSTRACT

An automated system is provided. The system includes: a manipulator coupled to: an opening forming device configured to create an opening having a predefined geometry partially into a multilayer component at a selected location on a surface of the multilayer component, where the multilayer component includes a plurality of material layers including at least a substrate and a bond coat, and where the opening exposes each of the plurality of material layers; and an imaging device configured to create an image of the exposed plurality of material layers in the opening; and a processor configured to calculate at least a thickness of the bond coat of the exposed plurality of material layers from the image and based on the predefined geometry of the opening. Methods of using the system to analyze layer thickness of a multilayer component and repair a multilayer component are also provided.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation-in-part patent application of U.S.patent application Ser. No. 16/701,243 filed Dec. 3, 2019, which claimsthe benefit of European Patent Application No. 18210779.7 filed Dec. 6,2018, the disclosures of which are herein incorporated by reference intheir entirety.

BACKGROUND OF THE INVENTION

The disclosure relates generally to non-destructive material testing,and more particularly, to a method of analyzing quantitative data aboutlayer(s) of a multilayer component, and a resulting multilayercomponent.

Quantitative investigations and quality checks of materials propertiesare oftentimes required to determine, for example, an applied coatingthickness, a depletion level, etc. Such assessments are oftentimesrequired for process qualification, regular production monitoring,determining the remaining lifetime for a multilayer component or as aninitial assessment to determine the scope of a repair for a multilayercomponent. In order to conduct these assessments, a cut up is taken froma commercial component. Consequently, the component is destroyed(scrapped) and needs to be replaced by a new part. Limitednon-destructive tests are available to assess, e.g., interfacedelamination or layer thicknesses with thermography, etc. for ceramiclayers on metallic substrates. However, these approaches lack theability to provide quantitative data regarding lifetime relevantproperties, and in particular, depletion of a bond coat. In addition,such assessments cannot be performed on-site (neither in-situ nor on adismounted part).

BRIEF DESCRIPTION OF THE INVENTION

A first aspect of the disclosure provides a method of analyzing layerthickness of a multilayer component, the method comprising: creating anopening having a predefined geometry partially into the multilayercomponent at a selected location on a surface of the multilayercomponent, wherein the multilayer component includes a plurality ofmaterial layers including a substrate and a bond coat and the openingexposes each of the plurality of material layers including thesubstrate; creating an image of the exposed plurality of material layersin the opening using a digital microscope; and calculating at least athickness of the bond coat of the exposed plurality of material layersfrom the image and based on the predefined geometry of the opening.

A second aspect of the disclosure provides a multilayer component,comprising: a substrate; a bond coat over the substrate; a thermalbarrier coating (TBC) layer over the bond coat, the TBC layer having afirst outer surface having indication of exposure to a hot gas pathenvironment; and a filled opening in the substrate, the bond coat andthe TBC layer, the filled opening including: a substrate repair fillfilling the filled opening in the substrate; a bond coat repair fillfilling the filled opening in the bond coat, and a thermal barriercoating (TBC) plug filling the filled opening in the TBC layer, the TBCplug having a second outer surface having no or less indication ofexposure to the hot gas path environment.

A third aspect of the disclosure includes a method of analyzing layerthickness of a multilayer component, the method comprising: drilling tocreate an opening having a predefined geometry partially into themultilayer component at a selected location on a surface of themultilayer component, wherein the multilayer component includes aplurality of material layers including a substrate, a bond coat over thesubstrate, and wherein the opening exposes each of the plurality ofmaterial layers; increasing a contrast of the exposed plurality ofmaterial layers exclusively in the opening from that present after theopening creating by polishing the exposed plurality of material layers,and etching the exposed plurality of material layers; creating an imageof the exposed plurality of material layers in the opening using adigital microscope; calculating at least a thickness of the bond coatfrom the image and based on the predefined geometry of the opening; andrepairing the opening, allowing the multilayer component to be used foran intended purpose thereof.

A fourth aspect of the disclosure includes an automated system foranalyzing layer thickness of a multilayer component, the automatedsystem comprising: a manipulator coupled to: an opening forming deviceconfigured to create an opening having a predefined geometry partiallyinto the multilayer component at a selected location on a surface of themultilayer component, wherein the multilayer component comprises aplurality of material layers including at least a substrate and a bondcoat, and wherein the opening exposes each of the plurality of materiallayers; and an imaging device configured to create an image of theexposed plurality of material layers in the opening; and a processorconfigured to calculate at least a thickness of the bond coat of theexposed plurality of material layers from the image and based on thepredefined geometry of the opening.

A fifth aspect of the disclosure includes a method of analyzing layerthickness of a multilayer component with an automated system comprisinga manipulator and a processor, the method comprising: receiving at themanipulator of the automated system the multilayer component; creatingan opening with an opening forming device coupled to the manipulator,the opening having a predefined geometry partially into the multilayercomponent at a selected location on a surface of the multilayercomponent, wherein the multilayer component comprises a plurality ofmaterial layers including at least a substrate and a bond coat, andwherein the opening exposes each of the plurality of material layers;creating with an imaging device coupled to the manipulator an image ofthe exposed plurality of material layers in the opening; and calculatingwith the processor of the automated system at least a thickness of thebond coat of the exposed plurality of material layers from the image andbased on the predefined geometry of the opening.

A sixth aspect of the disclosure includes a method of repairing amultilayer component with an automated system comprising a manipulatorand a processor, the method comprising: receiving at the manipulator ofthe automated system the multilayer component; creating an opening withan opening forming device coupled to the manipulator, the opening havinga predefined geometry partially into the multilayer component at aselected location on a surface of the multilayer component, wherein themultilayer component comprises a plurality of material layers includingat least a substrate and a bond coat, and wherein the opening exposeseach of the plurality of material layers; creating with an imagingdevice coupled to the manipulator an image of the exposed plurality ofmaterial layers in the opening; calculating with the processor of theautomated system at least a thickness of the bond coat of the exposedplurality of material layers from the image and based on the predefinedgeometry of the opening; and repairing with the repairing device coupledto the manipulator of the automated system the opening.

BRIEF DESCRIPTION OF THE DRAWINGS

These and other features of this disclosure will be more readilyunderstood from the following detailed description of the variousaspects of the disclosure taken in conjunction with the accompanyingdrawings that depict various embodiments of the disclosure, in which:

FIG. 1 shows a perspective view of an illustrative multilayer componentin the form of a turbine blade.

FIG. 2 shows a cross-sectional view of illustrative layers of amultilayer component.

FIG. 3 shows a cross-sectional view of creating an opening according toone embodiment of the disclosure.

FIG. 4 shows a cross-sectional view of creating an opening according toanother embodiment of the disclosure.

FIG. 5 shows a cross-sectional view of optionally increasing thecontrast of the layers in the opening according to one embodiment of thedisclosure.

FIG. 6 shows a cross-sectional view of creating an image of the layersin the opening according to one embodiment of the disclosure.

FIG. 7 shows an illustrative image of the layers in an opening accordingto one embodiment of the disclosure.

FIG. 8 shows a schematic view of layers of the opening for calculatinglayer thicknesses according to an embodiment of the disclosure.

FIG. 9 shows a cross-sectional view of layers of a repaired multilayercomponent according to an embodiment of the disclosure.

FIG. 10 shows a cross-sectional view of layers of a repaired multilayercomponent according to another embodiment of the disclosure.

FIG. 11 shows a block diagram of an example automated system accordingto an embodiment of the disclosure.

FIG. 12 shows a flow diagram of an example automated method according toan embodiment of the disclosure.

FIG. 13 shows a flow diagram of a second example automated methodaccording to an embodiment of the disclosure.

FIG. 14 shows a flow diagram of a third example automated methodaccording to an embodiment of the disclosure.

It is noted that the drawings of the disclosure are not to scale. Thedrawings are intended to depict only typical aspects of the disclosure,and therefore should not be considered as limiting the scope of thedisclosure. In the drawings, like numbering represents like elementsbetween the drawings.

DETAILED DESCRIPTION OF THE INVENTION

As an initial matter, in order to clearly describe the currentdisclosure it will become necessary to select certain terminology whenreferring to and describing relevant parts of a multilayer component.When doing this, if possible, common industry terminology will be usedand employed in a manner consistent with its accepted meaning. Unlessotherwise stated, such terminology should be given a broadinterpretation consistent with the context of the present applicationand the scope of the appended claims. Those of ordinary skill in the artwill appreciate that often a particular component may be referred tousing several different or overlapping terms. What may be describedherein as being a single part may include and be referenced in anothercontext as consisting of multiple components. Alternatively, what may bedescribed herein as including multiple components may be referred toelsewhere as a single part.

Where an element or layer is referred to as being “on,” “engaged to,”“disengaged from,” “connected to” or “coupled to” another element orlayer, it may be directly on, engaged, connected or coupled to the otherelement or layer, or intervening elements or layers may be present. Incontrast, when an element is referred to as being “directly on,”“directly engaged to,” “directly connected to” or “directly coupled to”another element or layer, there may be no intervening elements or layerspresent. Other words used to describe the relationship between elementsshould be interpreted in a like fashion (e.g., “between” versus“directly between,” “adjacent” versus “directly adjacent,” etc.). Asused herein, the term “and/or” includes any and all combinations of oneor more of the associated listed items.

Embodiments of the disclosure provide a method to analyze quantitativedata, like layer thickness, of a multilayer component. The methodobtains the required quantitative data with a mini-invasive impact of amultilayer component. In particular, an opening is created in themultilayer component that can be fully restored, where necessary, usingavailable (local) repair procedures while enabling the reuse of thecommercial multilayer component. In addition, the component assessmentcan be performed during component manufacture and at the site of use.The component can be repaired on-site using on-site repair solutions.

FIG. 1 shows a perspective view of an illustrative multilayer component100 in the form of a turbine blade. The teachings of the disclosure canbe applied to any multilayer component made using any method offormation of the layers, e.g., welding, brazing, thermal spray, etc. Asshown in the cross-sectional view of FIG. 2 , multilayer component 100may include a plurality of material layers. In the example shown, one ormore protective layers 106 may be over substrate 104. Substrate 104 mayinclude any metal or metal alloy that acts as a metal substrate, or aceramic such as ceramic matrix composite. For purposes of a turbineblade, substrate 104 may include, for example, a superalloy, which mayrefer to an alloy having numerous excellent physical characteristicscompared to conventional alloys, such as but not limited to: highmechanical strength, high thermal creep deformation resistance, etc.Superalloys include but are not limited to: Rene 108, CM247, Haynesalloys, Incalloy, MP98T, TMS alloys, CMSX single crystal alloys, N5, GTD444, MarM 247 and IN 738. Alternatively, substrate 104 can include avariety of other metals or metal alloys. “Gamma prime” (γ′) is theprimary strengthening phase in nickel-based alloys. Example high gammaprime superalloys include but are not limited to: Rene 108, N5, GTD 444,MarM 247 and IN 738. In one embodiment, bond coat 110 may include agamma-gamma prime structure (e.g., γ′ phase [Ni3(Al, Ti)] phase in gammamatrix γ-Ni(Co,Cr)), and in another embodiment, substrate 104 mayinclude a gamma-beta structure, e.g., β-NiAl phase in gamma matrixγ-Ni(Co,Cr). In terms of ceramic, substrate 104 can include any nowknown or later developed ceramic configured to perform in the hot gaspath environment.

Protective layer(s) 106 may include any now known or later developedprotective layer for, for example, protecting substrate 104 from a hot,corrosive environment. In one embodiment, protective layer(s) 106 mayinclude at least one of a bond coat 110 (also known as an overlay coatif used alone), and a top coat 112 over the bond coat (note, “top coat”does not necessarily indicate layer 112 as the outermost coating). Bondcoat 110 may include any now known or later developed bond coat materialsuch as but not limited to: nickel or platinum aluminides, nickelchromium aluminum yttrium (NiCrAlY) or nickel cobalt chromium aluminumyttrium (NiCoCrAlY). Bond coat 110 may include a gamma-gamma primestructure (e.g., γ′ phase [Ni3(Al, Ti)] phase in gamma matrixγ-Ni(Co,Cr)). In one embodiment, bond coat 110 may include a metal (M)with chromium-aluminum-yttrium alloy (MCrAlY) such as those commerciallyavailable from Amdry as model numbers 4522A, and 4522C. Bond coat 110may be applied using, for example, a high velocity oxygen fuel (HVOF)application, a low pressure plasma spraying (LPPS) or an atmosphericplasma spraying (APS).

A thermal barrier coating (TBC) layer 114 may be provided over bond coat110. TBC layer 114 material may include, for example, yttria-stabilizedzirconia (YSZ), mullite and alumina.

During operation, as shown in FIG. 3 , elements may diffuse from bondcoat 110, creating a depletion layer 118, some of which may eventuallyoxidize, creating a thermally grown oxide layer 116 (hereinafter “oxidelayer 116”). Depending on substrate 104 composition and how bond coat110 is formed, oxide layer 116 may or may not be formed during operationby diffusion of aluminum, e.g., γ′ phase [Ni3(Al, Ti)] phase in gammamatrix γ-Ni(Co,Cr) from bond coat 110.

Three example arrangements of substrate 104 and bond coat 110 for whichembodiments of the disclosure are advantageous include the following. A)Substrate 104 with a MCrAlY bond coat 110 of gamma-gamma prime structureapplied by HVOF or LPPS, which exhibits depletion in bond coat 110,creating depletion layer 118, that is identifiable using the teachingsof the disclosure. Here, for example, aluminum diffuses and oxidized toform oxide layer 116. Embodiments of the disclosure allow formeasurement of the depletion of bond coat 110. B) Substrate 104 with aMCrAlY bond coat 110 of gamma-beta structure applied by APS. Here, asshown in FIG. 4 , no depletion occurs and only bond coat 110 thicknessis measured using embodiments of the disclosure, i.e., becausedegradation of bond coat 110 cannot be measured with this method. C)Substrate 104 with a MCrAlY bond coat 110 of gamma-beta structureapplied by HVOF or LPPS. This latter arrangement exhibits depletionlayer 118 in bond coat 110, as shown in FIG. 3 , due to operation (likearrangement A) that is identifiable using the teachings of thedisclosure, i.e., aluminum diffuses and oxidizes to form oxide layer116. While two to three protective layers 106 have been illustrated, itis emphasized that the teachings of the disclosure are applicable to anynumber of layers and various diffusing element(s). Materials other thanTBC can also be employed.

FIGS. 3 and 4 also show creating an opening 120, i.e., a test siteopening, having a predefined geometry partially into multilayercomponent 100 at a selected location on a surface of the multilayercomponent 100. Prior to forming opening 120, in most cases as shown inFIG. 3 , at least a portion of TBC layer 114 is removed, e.g., by gritor sand blasting. Only an area of TBC layer 114 necessary to createopening 120, e.g., by drilling, needs to be removed. That is, not all ofTBC layer 114 needs to be removed, only an area slightly larger than anarea of a tool used to make opening 120. Opening 120 can be created in anumber of ways to form a predefined geometry in multilayer component100. In one embodiment, shown in FIG. 3 , opening 120 is created bydrilling to create a cone-shaped hole 122. Other holes of varying shapeare also possible. For example, FIG. 4 shows an opening 120 created bycalotte grinding to create a spherical segment opening 124. Othermaterial removal tools, e.g., a milling tool, can also be used to createa predefined geometry in multilayer component 100. “Predefined geometry”may include any shape for which the points, lines, surfaces, angles,lengths and other dimensions are known. As will be described, thepredefined geometry allows dimensions obtained from an image of opening120 to be used to calculate quantitative data about layers and inparticular bond coat 110, such as but not limited to: layer thicknesses,a depletion level, an inter-diffusion level, or the existence of a heataffected zone. In one example of the FIG. 3 embodiment, a drill bit mayhave a precise point angle between approximately 130 and 150°, and adiameter of, for example, approximately 2.5 millimeters to 7millimeters. A location of opening 120 can be user selected to, forexample, provide visual assessment of the components (new-make/afteruse) and define material properties, where desired. More than oneopening 120 can be used to test various localized areas of multilayercomponent 100. Dependent on component condition, different parameterscan be assessed at different locations without the conventionallimitations based on a specified cut-up plan for the component thatwould be required if destructive testing was used. Masks (not shown) canbe used for regular checks at reproducible locations.

As shown in FIG. 5 for the FIG. 3 drilling embodiment, opening 120exposes each of material layers 104, 110 (116, 118 where present)including substrate 104. That is, at least some portion of each layer104, 110 (116, 118 where present) is revealed by opening 120, e.g., asurface, a corner, an edge, etc. An opening 120 size may be based on avariety of factors such as but not limited to: coating thickness,expected worst case wall penetration thickness, minimum and/or maximumthickness of opening 120 desired, etc. An appropriate drill bit diameterand angle may be selected based on any of those factor(s). Substrate 104should be exposed to a minimal degree, and should be so exposed in amanner to not create a crack or other extensive damage therein. Drillingspeed and down pressure are precisely controlled to achieve the abovesituation.

In some cases, it is beneficial to increase the contrast compared tothat present after opening 120 is created. FIG. 5 also shows optionallyincreasing a contrast of the exposed plurality of material layers 104,110, 118 exclusively in opening 120. In one embodiment, the process caninclude polishing the exposed plurality of material layers 104, 106.This process may include, for example, polishing using a felt 140 with adiamond paste 142. In this case, increasing the contrast may alsooptionally include etching 144 the exposed plurality of material layers104, 106, e.g., after polishing. The etching may include using any nowknown or later developed etchant such as but not limited to: amolybdic-etchant for aluminum rich phases, or Murakami-etchant forchromium rich phases. The surface contrast can also be enhanced byelectrochemical etching. Polishing may be advantageous, for example,where bond coat 110 is depleted, such as in arrangements A) and C),described herein. In this fashion, embodiments of the disclosure canattain bond coat 110 thickness and depletion layer 118 thickness, i.e.,how much of bond coat 110 is diffused forming a depletion layer 118 (andoxide layer 116) and how much remains as bond coat 110. The depletionlayer 118 thickness and the bond coat 110 thickness can be related toremaining lifetime of bond coat 110, i.e., life expectancy of bond coat110. In other embodiments, it is not necessary to increase the contrast,i.e., there is no polishing or etching performed. This latter processmay be applied to certain bond coats 110 that are not depleted, e.g.,any deterioration is due to inner oxidation such as with arrangement B),described herein.

FIG. 6 shows creating an image of exposed plurality of material layers104, 106 in opening 120 using a digital microscope 150, e.g., a handheldand portable version. Digital microscope 150 may include any now knownor later developed microscope. In one embodiment, digital microscope 150can be handheld and portable so it can be used in the field of use ofmultilayer component, e.g., inside a turbine.

FIG. 7 shows an example image 152 of opening 120 and the exposedmaterial layers for a used multilayer component 100. It is understoodthat a newly manufactured multilayer component 100 would only have bondcoat 110 and substrate 104 present. A depth or thickness of bond coat110 can be calculated from image 152 based on the predefined geometry ofopening 120. FIG. 8 shows a schematic of dimensions pulled from image152 for opening 120 in FIG. 6 , e.g., lateral diameters of layers d₁, d₂and d₃ of layers 104, 110, 118, respectively. The predefined geometry ofopening 120 provides a known angle α of exposed surfaces of layers 104,110, 118. Application of trigonometry leads to T1=((d₂/2)−(d₁/2))tan β,and T2=((d₃/2)−(d₂/2))tan β. Angle β is the angle of opening 120relative to horizontal. Thus, the thickness of bond coat 110 (T1) can bedetermined. Further, where present, a thickness of depletion layer 118(T2) can be determined. The thickness of depletion layer 118 (T2)indicates an amount of depletion of bond coat 110. That is, thickness ofdepletion layer 118 can be used to determine the remaining life (lifeexpectancy) of bond coat 110.

Based on the calculated thickness(es), determinations of quantitativedata can be ascertained such as but not limited to: bond coat 110thickness, i.e., intact bond coat 110 thickness, and depletion layer 118thickness resulting from the diffusion process. For new manufacture, athickness of bond coat 110 can be used to confirm, for example, thequality of the product and to benchmark bond coat thickness for laterevaluation. For used multilayer components 100, the amount of depletionof bond coat 110 can be used, for example, to project remaining lifeexpectancy using conventional algorithmic or empirically based modelingtechniques. For example, for a known bond coat material, if 50% of bondcoat 110 is used, it may indicate it has 1200 operating hours left underexpected operating conditions of multilayer component 100. Further, thethickness of bond coat 110 and/or the thickness of depletion layer 118can also be used to determine life expectancy of bond coat 110.

In contrast to conventional destructive material testing, multilayercomponent 100 can be assessed, and can be repaired, where necessary.That is, opening 120 can be repaired, allowing multilayer component 100to be used for an intended purpose thereof, e.g., as an airfoil. Therepairing process can include any now known or later developed repairprocesses for an opening 120 in the materials provided. For example,substrate 104 and bond coat 110 repair may include at least one of laserwire welding or tungsten inert gas (TIG) welding. The repairing devicemay be handheld. Alternatively, substrate 104 and/or bond coat 110 maybe repaired by a thermal spray process, e.g., APS, flame spraying, etc.TBC layer 114 repair may include any thermal spray process such as oneof APS and flame spraying. Alternatively, TBC 114 may include a slurrycoating process. Oxide layer 116 is not repaired. FIG. 9 shows opening120 (for FIG. 3 embodiment) repaired.

As noted, embodiments of the method described herein may be performedprior to use of the multilayer component 100, i.e., after manufacture,to confirm proper fabrication and/or benchmark layer thicknesses.Alternatively, embodiments of the disclosure can be performed at ageographic location of use of multilayer component 100, e.g., a powerplant in the case of a turbine rotor blade. Where multilayer component100 is on site, it can be dismounted from its use setting, or it canremain in its use setting, e.g., inside a turbine. If it remains inplace, multilayer component 100 can be used after the repairing ofopening 120, e.g., without reinstallation. If on site, the repairing ofopening 120 may include using at least one handheld device, e.g., TIGwelder, flame spray, etc.

FIG. 9 shows a cross-sectional view of a used (i.e., ex-service)multilayer component 100 after exposure to methods according toembodiments of the disclosure. Multilayer component 100 may include asubstrate 104, a bond coat 110 over substrate 104, and a TBC layer 114over bond coat 110. TBC layer 114 has a first outer surface 170 havingindications of exposure to a hot gas path environment, e.g., from use ina gas turbine. That is, first outer surface 170 may be, for example,dirty, worn, and/or have a different color or shade. A filled opening172 is in substrate 104, bond coat 110 and, where provided, TBC layer114. Oxide layer 116 and/or depletion layer 118 may exist outside offilled opening 172. Filled opening 172 includes a substrate repair fill164, including material that is either identical to or similar to(perhaps better properties) the metal of substrate 104, that fillsfilled opening 172 in substrate 104, i.e., in a substrate portion 160 ofopening 120. Multilayer component 100 also includes a bond coat repairfill 174 filling filled opening 172 in bond coat 110, i.e., in a bondcoat portion 168 of opening 120. Bond coat repair fill 174 includesmaterial either identical or similar to (perhaps better properties) bondcoat 110. As shown, since opening 120 in substrate 104 is very small,substrate repair fill 164 may be the same material as bond coat repairfill 174, i.e., repair fill 164 and 174 are the same. In this situation,bond coat repair fill 174 extends into substrate 104. A thermal barriercoating (TBC) plug 176 fills filled opening 172 in TBC layer 114, i.e.,where TBC layer 114 was removed. TBC plug 176 has a second outer surface176 having no or less indications of exposure than first outer surface170 of TBC layer 114 since it has not seen an operation atmosphere andtemperature or has been applied with a different manufacturing process,i.e., it is newer (maybe with slightly different properties e.g.porosity) and has less dirt thereon, and may have a differentcolor/shading than TBC layer 114. Either of TBC plug 176 (shown) or bondcoat repair fill 174 may fill filled opening 172 in oxide layer 116and/or depletion layer 118. In the FIG. 9 example, opening 120 has aperiphery having at least a portion with a cone-shape. It is understoodthat where opening 120 according to the FIG. 4 embodiment is employed,opening 120 would have a periphery having at least a spherical shapedportion. In any event, however, as shown in FIG. 9 , the periphery ofopening 120 is invisible to the naked eye in an outermost layer, e.g.,TBC layer 114 and TBC plug 176. A final repair process may includecontouring outer surfaces 170, 176 of multilayer component 100, e.g., bygrinding or polishing.

FIG. 10 shows another embodiment in which the repair includes onlyrepairing substrate 104 with substrate repair fill 164, and bond coat110 with bond coat repair fill 174, in filled opening 172. Here,depletion layer 118, oxide layer 116 and TBC layer 114 are not present.Again, since opening 120 in substrate 104 is very small, substraterepair fill 164 may be the same material as bond coat repair fill 174,i.e., repair fill 164 and 174 are the same. TBC layer 114 is notprovided or repaired. A final repair process may include contouring asurface 154 of multilayer component 100, e.g., by grinding or polishing.In FIG. 10 , opening 120 existence is invisible to the naked eye onsurface 154. However, if cut open, remnants of opening 120 may beobserved in multilayer component 100.

Embodiments of the disclosure provide quantitative assessment (e.g.,thickness, depletion, bonding, heat affected zone, etc.) of a multilayercomponent (e.g., substrate with coating, brazing, welding, etc.) havinga minimal destructive impact on the commercial component while enablingits reuse by a localized material restoration, where necessary. Themethod thus avoids full metallurgical investigation bysectioning/destruction of commercial parts, and avoids scrap-parts formetallurgical investigation of multilayer components. In addition, themethods allow for condition-based repair, and enables repair scopereduction compared to destructive testing techniques. The methods can beused during manufacture or after use, in the field.

[Note: the following descriptions and claims are new additions since theparent application.]

Any of the embodiments of this disclosure may be performed manually,with automation, or with a combination of manually and with automation.In some embodiments, the methods are automated. In some embodiments, themethods are automated with any suitable automation techniques known inthe art that facilitate the success of the methods described herein. Insome embodiments, the methods are automated with an automated system.

FIG. 11 shows a block diagram of an example automated system 200 foranalyzing layer thickness of a multilayer component part 300. Automatedsystem 200 may be used according to the methods of the presentdisclosure, including the methods shown in FIGS. 12-14 .

Automated system 200 includes a processor 202, a controller 204, a powersupply 206, a manipulator 208, and attachments 210.

The processor 202 may be any suitable processor known in the art thatfacilitates the success of the systems described herein. The processor202 is configured to process image processing software. The processor202 is also configured to calculate at least a thickness of the bondcoat and/or a thickness of the depletion layer of an exposed pluralityof material layers from an image and based on a predefined geometry ofthe opening.

The controller 204 may be any suitable controller known in the art thatfacilitates the success of the systems described herein. The controller204 is in electronic communication with, and configured to control eachof, the power supply 206, the processor 202, and the manipulator 208.

The power supply 206 may be any suitable controller known in the artthat facilitates the success of the systems described herein.

The manipulator 208 may be any suitable manipulator known in the artthat facilitates the success of the systems described herein. Themanipulator 208 may be in the form of a robotic arm. The manipulator 208may be mechanically and/or electronically coupled to one or moreattachments 212 and/or one or more tools 400. The tools 400 are separatefrom the automated system 200 and the attachments 210 may be detachablefrom the automated system 200. The manipulator 208 is configured tointeract with the multilayer component part 300, the attachments 210,and the tools 400.

The attachments 210 may be any suitable attachments known in the artthat facilitate the success of the systems described herein. Forexample, the manipulator may have a drill device attachment fordrilling, a polishing device attachment for polishing and preparation,and an imaging device attachment for imaging.

FIG. 12 shows a flow diagram of an example automated method 500 ofanalyzing layer thickness of a multilayer component part with anautomated system comprising a manipulator and a processor. The methodincludes receiving 502 at a manipulator of the automated system themultilayer component; creating 504 an opening with an opening formingdevice coupled to the manipulator, the opening having a predefinedgeometry partially into the multilayer component at a selected locationon a surface of the multilayer component, wherein the multilayercomponent comprises a plurality of material layers including at least asubstrate and a bond coat, and wherein the opening exposes each of theplurality of material layers; creating 506 with an imaging devicecoupled to the manipulator an image of the exposed plurality of materiallayers in the opening; and calculating 508 with the processor of theautomated system at least a thickness of the bond coat of the exposedplurality of material layers from the image and based on the predefinedgeometry of the opening.

FIG. 13 shows a flow diagram of an example automated method 600 ofrepairing a multilayer component with an automated system comprising amanipulator and a processor. The method includes receiving 602 at amanipulator of the automated system the multilayer component; creating604 an opening with an opening forming device coupled to themanipulator, the opening having a predefined geometry partially into themultilayer component at a selected location on a surface of themultilayer component, wherein the multilayer component comprises aplurality of material layers including at least a substrate and a bondcoat, and wherein the opening exposes each of the plurality of materiallayers; creating 606 with an imaging device coupled to the manipulatoran image of the exposed plurality of material layers in the opening;calculating 608 with the processor of the automated system at least athickness of the bond coat of the exposed plurality of material layersfrom the image and based on the predefined geometry of the opening; andrepairing 610 with the repairing device coupled to the manipulator ofthe automated system the opening.

FIG. 14 shows a flow diagram of an example automated method 700 ofanalyzing layer thickness of a multilayer component part. A multilayercomponent part is loaded 702 to an automated system. A manipulatordrills 704 a hole on the multilayer component part. The manipulator uses706 a polishing device to polish and prepare the hole surface. Themanipulator uses 708 an imaging device to record an image of the hole.The image is provided 710 to machine vision software. The hole andcoating layers are located 712 in the image. Visual features fordepletion and oxidation are located 714 with deep learning algorithms.The visual features are evaluated 716 for depletion and oxidation.Evaluation results are presented 718. This example automated method 700is capable of rapid and cost-effective evaluation and/or repair.

The multilayer component part may be loaded 702 with any suitableloading technique known in the art that facilitate the success of themethods described herein. In some embodiments, the multilayer componentpart is received at the manipulator. In some embodiments, the multilayercomponent part is provided to the manipulator. In some embodiments, themanipulator approaches one or more pre-defined points of the multilayercomponent part.

The manipulator may be any suitable loading manipulator known in the artthat facilitates the success of the methods described herein. In someembodiments, the manipulator is a robotic manipulator. In someembodiments, the manipulator is fully automated. In some embodiments,the manipulator is partially automated.

The manipulator uses a variety of tools. The tools may be in the form ofindividual tools, devices including tools, and/or tool attachments. Thetools may be integrated with the manipulator and/or readily available tothe manipulator. For example, the manipulator may have a drill deviceattachment for drilling, a polishing device attachment for polishing andpreparation, and an imaging device attachment for imaging. Each of thesetools may be used sequentially or simultaneously. Where the tools arenot integrated with the manipulator, the manipulator may exchange onetool for another. The manipulator may exchange or switch tools at anypoint in the method.

The manipulator drills 704 a hole on the multilayer component part. Insome embodiments, the manipulator machines a surface of the multilayercomponent part to produce a hole having a required shape at a defineddepth. The shape may be any shape, including circles, regular orirregular polygons, squares, rectangles, triangles, pentagons, hexagons,heptagons, or octagons. In some embodiments, the manipulator machines asurface of the multilayer component part to produce a hole at apredefined location. The predefined hole shape is deep enough to reachthe base material and sized to show all layers of coating.

After drilling the hole, the manipulator uses 706 a polishing device toclear the machined surface and prepare it for inspection. The polishingdevices removes debris from the hole. The polishing device may alsoapply an etchant.

After the hole is prepared, the manipulator records 708 one or moreimages of the prepared surface. The one or more images may include asingle still image in a picture format or a series of images in a videoformat. The one or more images may be recorded at the same viewpoint ordifferent viewpoints. The one or more images may be recorded at the sametime or different times.

The one or more recorded images are provided 710 to image processingsoftware (e.g., machine vision software) which analyzes the one or moreimages with an algorithm. The algorithm may be any suitable algorithmknown in the art that facilitates the success of the methods describedherein. In some embodiments, the algorithm is an artificial intelligencealgorithm, a machine learning algorithm, a deep learning algorithm, or acombination thereof.

The image processing software may perform any suitable analysis known inthe art that facilitates the success of the methods described herein. Insome embodiments, the image processing software analyzes the one or moreimages to locate 712 the hole and the coating layers, to locate 714visual features for depletion and oxidation, and/or to evaluate 716depletion and oxidation.

After analysis, the image processing software generates and/or presents718 a report that includes the analysis results. The report may begenerated manually or by automation. In some embodiments, the reportincludes information relating evaluated depletion and/or oxidation. Insome embodiments, the report includes a determination of pass or failfor the multilayer component part. For example, if the multilayercomponent part exhibits depletion and/or oxidation exceeding apredefined standard, then the report may indicate a status of fail forthat multilayer component part.

The foregoing drawings show some of the processing associated accordingto several embodiments of this disclosure. In this regard, it shouldalso be noted that in some alternative implementations, the acts notedmay occur out of the order described or, for example, may in fact beexecuted substantially concurrently or in the reverse order, dependingupon the act involved. Also, one of ordinary skill in the art willrecognize that additional steps that describe the processing may beadded.

The terminology used herein is for the purpose of describing particularembodiments only and is not intended to be limiting of the disclosure.As used herein, the singular forms “a”, “an” and “the” are intended toinclude the plural forms as well, unless the context clearly indicatesotherwise. It will be further understood that the terms “comprises”and/or “comprising,” when used in this specification, specify thepresence of stated features, integers, steps, operations, elements,and/or components, but do not preclude the presence or addition of oneor more other features, integers, steps, operations, elements,components, and/or groups thereof “Optional” or “optionally” means thatthe subsequently described event or circumstance may or may not occur,and that the description includes instances where the event occurs andinstances where it does not.

Approximating language, as used herein throughout the specification andclaims, may be applied to modify any quantitative representation thatcould permissibly vary without resulting in a change in the basicfunction to which it is related. Accordingly, a value modified by a termor terms, such as “about,” “approximately” and “substantially,” are notto be limited to the precise value specified. In at least someinstances, the approximating language may correspond to the precision ofan instrument for measuring the value. Here and throughout thespecification and claims, range limitations may be combined and/orinterchanged, such ranges are identified and include all the sub-rangescontained therein unless context or language indicates otherwise.“Approximately” as applied to a particular value of a range applies toboth values, and unless otherwise dependent on the precision of theinstrument measuring the value, may indicate +/−10% of the statedvalue(s).

The corresponding structures, materials, acts, and equivalents of allmeans or step plus function elements in the claims below are intended toinclude any structure, material, or act for performing the function incombination with other claimed elements as specifically claimed. Thedescription of the present disclosure has been presented for purposes ofillustration and description, but is not intended to be exhaustive orlimited to the disclosure in the form disclosed. Many modifications andvariations will be apparent to those of ordinary skill in the artwithout departing from the scope and spirit of the disclosure. Theembodiment was chosen and described in order to best explain theprinciples of the disclosure and the practical application, and toenable others of ordinary skill in the art to understand the disclosurefor various embodiments with various modifications as are suited to theparticular use contemplated.

Further aspects of the present disclosure are provided by the subjectmatter of the following clauses:

1. A method of analyzing layer thickness of a multilayer component, themethod comprising:

-   -   creating an opening having a predefined geometry partially into        the multilayer component at a selected location on a surface of        the multilayer component, wherein the multilayer component        includes a plurality of material layers including a substrate        and a bond coat and the opening exposes each of the plurality of        material layers including the substrate;    -   creating an image of the exposed plurality of material layers in        the opening using a digital microscope; and    -   calculating at least a thickness of the bond coat of the exposed        plurality of material layers from the image and based on the        predefined geometry of the opening.

2. The method of any preceding clause, wherein the bond coat includesMrCrAlY, and the plurality of material layers further includes adepletion layer over the bond coat, and

-   -   further comprising determining a thickness of the depletion        layer.

3. The method of any preceding clause, further comprising determining alife expectancy of the bond coat based on the at least one of thethickness of the depletion layer and the thickness of the bond coat.

4. The method of any preceding clause, wherein the plurality of materiallayers further includes an oxide layer over the depletion layer.

5. The method of any preceding clause, wherein the opening creatingincludes drilling to create a cone-shaped hole.

6. The method of any preceding clause, further comprising increasing acontrast of the exposed plurality of material layers exclusively in theopening from that present after the opening creating.

7. The method of any preceding clause, wherein the increasing contrastincludes:

-   -   polishing the exposed plurality of material layers; and    -   etching the exposed plurality of material layers.

8. The method of any preceding clause, wherein the polishing includesusing a felt with a diamond paste, and the etching includes using anetchant.

9. The method of any preceding clause, wherein the plurality of materiallayers includes an oxide layer over the bond coat and the bond coat overthe substrate.

10. The method of any preceding clause, further comprising repairing theopening, allowing the multilayer component to be used for an intendedpurpose thereof.

11. The method of any preceding clause, wherein prior to the drilling,the multilayer component further includes a thermal barrier coating(TBC) layer over the oxide layer, and further comprising removing atleast a portion of the TBC layer prior to the drilling, and wherein therepairing includes repairing the at least a portion of the TBC layer.

12. The method of any preceding clause, wherein the method is performedprior to use of the multilayer component.

13. The method of any preceding clause, wherein prior to the drilling,the multilayer component further includes a thermal barrier coating(TBC) layer over the bond coat, and further comprising removing at leasta portion of the TBC layer prior to the drilling, and wherein therepairing includes repairing the at least a portion of the TBC layer.

14. The method of any preceding clause, wherein the method is performedat a geographic location of a use site of the multilayer component.

15. The method of any preceding clause, wherein the repairing theopening includes using at least one handheld device.

16. A multilayer component, comprising:

-   -   a substrate;    -   a bond coat over the substrate;    -   a thermal barrier coating (TBC) layer over the bond coat, the        TBC layer having a first outer surface indications of exposure        to a hot gas path environment; and    -   a filled opening in the substrate, the bond coat and the TBC        layer, the filled opening including:        -   a substrate repair fill filling the filled opening in the            substrate,    -   a bond coat repair fill filling the filled opening in the bond        coat, and    -   a thermal barrier coating (TBC) plug filling the filled opening        in the TBC layer, the TBC plug having a second outer surface        having no or less indications of exposure to the hot gas path        environment than the first outer surface.

17. The multilayer component of any preceding clause, wherein thesubstrate repair fill filling the filled opening in the substrate is thesame material as the bond coat repair fill filling the filled opening inthe bond coat.

18. A method of analyzing layer thickness of a multilayer component, themethod comprising:

-   -   drilling to create an opening having a predefined geometry        partially into the multilayer component at a selected location        on a surface of the multilayer component, wherein the multilayer        component includes a plurality of material layers including a        substrate, a bond coat over the substrate, and wherein the        opening exposes each of the plurality of material layers;    -   increasing a contrast of the exposed plurality of material        layers exclusively in the opening from that present after the        opening creating by polishing the exposed plurality of material        layers, and etching the exposed plurality of material layers;    -   creating an image of the exposed plurality of material layers in        the opening using a digital microscope;    -   calculating a thickness of the bond coat from the image and        based on the predefined geometry of the opening; and    -   repairing the opening, allowing the multilayer component to be        used for an intended purpose thereof.

19. The method of any preceding clause, wherein the method is performedat a geographic location of a field of use site of the multilayercomponent.

20. The method of any preceding clause, wherein prior to the drilling,the multilayer component further includes a thermal barrier coating(TBC) layer over the oxide layer, and further comprising removing theTBC layer prior to the drilling, and wherein the repairing includesrepairing the TBC layer.

21. A system for analyzing layer thickness of a multilayer component,the system comprising:

-   -   an opening forming device configured to create an opening having        a predefined geometry partially into the multilayer component at        a selected location on a surface of the multilayer component,        wherein the multilayer component comprises a plurality of        material layers including at least a substrate and a bond coat        and wherein the opening exposes each of the plurality of        material layers; and    -   an imaging device configured to create an image of the exposed        plurality of material layers in the opening;    -   wherein the system is configured to calculate at least a        thickness of the bond coat of the exposed plurality of material        layers from the image and based on the predefined geometry of        the opening.

22. The system of any preceding clause, wherein the plurality ofmaterial layers further includes a depletion layer extending over thebond coat and the system is further configured to determine a thicknessof the depletion layer.

23. The system of any preceding clause, wherein the system is furtherconfigured to determine a life expectancy of the bond coat based on theat least one of the thickness of the depletion layer and the thicknessof the bond coat.

24. The system of any preceding clause, further comprising a contrastincreasing device configured to increase a contrast of the exposedplurality of material layers in the opening.

25. The system of any preceding clause, wherein the contrast increasingdevice is selected from the group consisting of a polisher, a felt withdiamond paste, an etchant, an electrochemical etchant, and combinationsthereof.

26. The system of any preceding clause, further comprising a TBC layerremoving device.

27. The system of any preceding clause, wherein the TBC layer removingdevice is a grit or sand blaster.

28. The system of any preceding clause, wherein the opening formingdevice is selected from the group consisting of drilling devices,calotte grinding devices, material removal tools, milling tools, andcombinations thereof.

29. The system of any preceding clause, wherein the imaging device is amicroscope.

30. The system of any preceding clause, wherein the imaging device ishandheld and portable.

31. A system for repairing a multilayer component, the systemcomprising:

-   -   an opening forming device configured to create an opening having        a predefined geometry partially into the multilayer component at        a selected location on a surface of the multilayer component,        wherein the multilayer component comprises a plurality of        material layers including at least a substrate and a bond coat        and wherein the opening exposes each of the plurality of        material layers;    -   an imaging device configured to create an image of the exposed        plurality of material layers in the opening; and    -   a repairing device configured to repair the opening;    -   wherein the system is configured to calculate at least a        thickness of the bond coat of the exposed plurality of material        layers from the image and based on the predefined geometry of        the opening prior to the repair of the opening.

32. The system of any preceding clause, further comprising a contrastincreasing device configured to increase a contrast of the exposedplurality of material layers in the opening.

33. The system of any preceding clause, wherein the contrast increasingdevice is selected from the group consisting of a polisher, a felt withdiamond paste, an etchant, an electrochemical etchant, and combinationsthereof.

34. The system of any preceding clause, wherein the repairing device isa handheld device.

35. The system of any preceding clause, wherein the repairing device isconfigured for high velocity oxygen fuel (HVOF) application, lowpressure plasma spraying (LPPS), and/or atmospheric plasma spraying(APS).

36. The system of any preceding clause, wherein the repairing device isselected from the group consisting of a laser wire welding device, atungsten inert gas (TIG) welding device, a thermal spray process device,an atmospheric plasma spray (APS) device, a flame spraying device, aslurry coating device, and combinations thereof.

37. The system of any preceding clause, wherein the repairing device isconfigured to receive a multilayer component that has been dismountedfrom a use setting.

38. The system of any preceding clause, wherein the use setting isinside a turbine.

39. The system of any preceding clause, wherein the multilayer componentis used in an airfoil.

40. The system of any preceding clause, wherein the multilayer componentis used in a turbine blade.

41. An automated system for analyzing layer thickness of a multilayercomponent, the automated system comprising:

-   -   a manipulator coupled to:        -   an opening forming device configured to create an opening            having a predefined geometry partially into the multilayer            component at a selected location on a surface of the            multilayer component, wherein the multilayer component            comprises a plurality of material layers including at least            a substrate and a bond coat, and wherein the opening exposes            each of the plurality of material layers; and        -   an imaging device configured to create an image of the            exposed plurality of material layers in the opening; and    -   a processor configured to calculate at least a thickness of the        bond coat of the exposed plurality of material layers from the        image and based on the predefined geometry of the opening.

42. The automated system of any preceding clause, wherein the pluralityof material layers further includes a depletion layer extending over thebond coat and the processor is further configured to determine athickness of the depletion layer.

43. The automated system of any preceding clause, wherein the processoris further configured to determine a life expectancy of the bond coatbased on the at least one of the thickness of the depletion layer andthe thickness of the bond coat.

44. The automated system of any preceding clause, wherein at least oneof the opening forming device and the imaging device are coupled to themanipulator in the form of attachments attached to the manipulator.

45. The automated system of any preceding clause, wherein at least oneof the opening forming device and the imaging device are coupled to themanipulator in the form of tools separate from the manipulator.

46. The automated system of any preceding clause, wherein themanipulator is further coupled to at least one of a contrast increasingdevice configured to increase a contrast of the exposed plurality ofmaterial layers in the opening, a repairing device configured to repairthe opening, and a TBC layer removing device.

47. The automated system of any preceding clause, wherein at least oneof the contrast increasing device, the repairing device, and the TBClayer removing device are coupled to the manipulator in the form ofattachments attached to the manipulator.

48. The automated system of any preceding clause, wherein at least oneof the contrast increasing device, the repairing device, and the TBClayer removing device are coupled to the manipulator in the form oftools separate from the manipulator.

49. The automated system of any preceding clause, further comprising acontroller and/or a power supply.

50. The automated system of any preceding clause, wherein themanipulator is configured to receive a multilayer component that hasbeen dismounted from a use setting.

51. The automated system of any preceding clause, wherein the usesetting is inside a turbine.

52. The automated system of any preceding clause, wherein the multilayercomponent is used in an airfoil.

53. The automated system of any preceding clause, wherein the multilayercomponent is used in a turbine blade.

54. A method of analyzing layer thickness of a multilayer component withan automated system comprising a manipulator and a processor, the methodcomprising:

-   -   receiving at the manipulator of the automated system the        multilayer component;    -   creating an opening with an opening forming device coupled to        the manipulator, the opening having a predefined geometry        partially into the multilayer component at a selected location        on a surface of the multilayer component, wherein the multilayer        component comprises a plurality of material layers including at        least a substrate and a bond coat, and wherein the opening        exposes each of the plurality of material layers;    -   creating with an imaging device coupled to the manipulator an        image of the exposed plurality of material layers in the        opening; and    -   calculating with the processor of the automated system at least        a thickness of the bond coat of the exposed plurality of        material layers from the image and based on the predefined        geometry of the opening.

55. The method of any preceding clause, wherein the plurality ofmaterial layers further includes a depletion layer extending over thebond coat, and wherein the method further comprises determining athickness of the depletion layer.

56. The method of any preceding clause, further comprising determining alife expectancy of the bond coat based on the at least one of thethickness of the depletion layer and the thickness of the bond coat.

57. A method of repairing a multilayer component with an automatedsystem comprising a manipulator and a processor, the method comprising:

-   -   receiving at the manipulator of the automated system the        multilayer component;    -   creating an opening with an opening forming device coupled to        the manipulator, the opening having a predefined geometry        partially into the multilayer component at a selected location        on a surface of the multilayer component, wherein the multilayer        component comprises a plurality of material layers including at        least a substrate and a bond coat, and wherein the opening        exposes each of the plurality of material layers;    -   creating with an imaging device coupled to the manipulator an        image of the exposed plurality of material layers in the        opening;    -   calculating with the processor of the automated system at least        a thickness of the bond coat of the exposed plurality of        material layers from the image and based on the predefined        geometry of the opening; and    -   repairing with the repairing device coupled to the manipulator        of the automated system the opening.

58. The method of any preceding clause, wherein the plurality ofmaterial layers further includes a depletion layer extending over thebond coat, and wherein the method further comprises determining athickness of the depletion layer.

59. The method of any preceding clause, further comprising determining alife expectancy of the bond coat based on the at least one of thethickness of the depletion layer and the thickness of the bond coat.

60. The method of any preceding clause, wherein prior to the creating anopening, the multilayer component further includes a thermal barriercoating (TBC) layer extending over the oxide layer, wherein the methodfurther comprises removing the TBC layer prior to the creating anopening, and wherein the repairing includes repairing the TBC layer.

What is claimed is:
 1. An automated system for analyzing layer thicknessof a multilayer component, the automated system comprising: amanipulator coupled to: an opening forming device configured to createan opening having a predefined geometry partially into the multilayercomponent at a selected location on a surface of the multilayercomponent, wherein the multilayer component comprises a plurality ofmaterial layers including at least a substrate and a bond coat, andwherein the opening exposes each of the plurality of material layers;and an imaging device configured to create an image of the exposedplurality of material layers in the opening; and a processor configuredto calculate at least a thickness of the bond coat of the exposedplurality of material layers from the image and based on the predefinedgeometry of the opening.
 2. The automated system of claim 1, wherein theplurality of material layers further includes a depletion layerextending over the bond coat and the processor is further configured todetermine a thickness of the depletion layer.
 3. The automated system ofclaim 2, wherein the processor is further configured to determine a lifeexpectancy of the bond coat based on the at least one of the thicknessof the depletion layer and the thickness of the bond coat.
 4. Theautomated system of claim 1, wherein at least one of the opening formingdevice and the imaging device are coupled to the manipulator in the formof attachments attached to the manipulator.
 5. The automated system ofclaim 1, wherein at least one of the opening forming device and theimaging device are coupled to the manipulator in the form of toolsseparate from the manipulator.
 6. The automated system of claim 1,wherein the manipulator is further coupled to at least one of a contrastincreasing device configured to increase a contrast of the exposedplurality of material layers in the opening, a repairing deviceconfigured to repair the opening, and a TBC layer removing device. 7.The automated system of claim 6, wherein at least one of the contrastincreasing device, the repairing device, and the TBC layer removingdevice are coupled to the manipulator in the form of attachmentsattached to the manipulator.
 8. The automated system of claim 6, whereinat least one of the contrast increasing device, the repairing device,and the TBC layer removing device are coupled to the manipulator in theform of tools separate from the manipulator.
 9. The automated system ofclaim 1, further comprising a controller and/or a power supply.
 10. Theautomated system of claim 1, wherein the manipulator is configured toreceive a multilayer component that has been dismounted from a usesetting.
 11. The automated system of claim 10, wherein the use settingis inside a turbine.
 12. The automated system of claim 10, wherein themultilayer component is used in an airfoil.
 13. The automated system ofclaim 10, wherein the multilayer component is used in a turbine blade.14. A method of analyzing layer thickness of a multilayer component withan automated system comprising a manipulator and a processor, the methodcomprising: receiving at the manipulator of the automated system themultilayer component; creating an opening with an opening forming devicecoupled to the manipulator, the opening having a predefined geometrypartially into the multilayer component at a selected location on asurface of the multilayer component, wherein the multilayer componentcomprises a plurality of material layers including at least a substrateand a bond coat, and wherein the opening exposes each of the pluralityof material layers; creating with an imaging device coupled to themanipulator an image of the exposed plurality of material layers in theopening; and calculating with the processor of the automated system atleast a thickness of the bond coat of the exposed plurality of materiallayers from the image and based on the predefined geometry of theopening.
 15. The method of claim 14, wherein the plurality of materiallayers further includes a depletion layer extending over the bond coat,and wherein the method further comprises determining a thickness of thedepletion layer.
 16. The method of claim 15, further comprisingdetermining a life expectancy of the bond coat based on the at least oneof the thickness of the depletion layer and the thickness of the bondcoat.
 17. A method of repairing a multilayer component with an automatedsystem comprising a manipulator and a processor, the method comprising:receiving at the manipulator of the automated system the multilayercomponent; creating an opening with an opening forming device coupled tothe manipulator, the opening having a predefined geometry partially intothe multilayer component at a selected location on a surface of themultilayer component, wherein the multilayer component comprises aplurality of material layers including at least a substrate and a bondcoat, and wherein the opening exposes each of the plurality of materiallayers; creating with an imaging device coupled to the manipulator animage of the exposed plurality of material layers in the opening;calculating with the processor of the automated system at least athickness of the bond coat of the exposed plurality of material layersfrom the image and based on the predefined geometry of the opening; andrepairing with the repairing device coupled to the manipulator of theautomated system the opening.
 18. The method of claim 17, wherein theplurality of material layers further includes a depletion layerextending over the bond coat, and wherein the method further comprisesdetermining a thickness of the depletion layer.
 19. The method of claim18, further comprising determining a life expectancy of the bond coatbased on the at least one of the thickness of the depletion layer andthe thickness of the bond coat.
 20. The method of claim 17, whereinprior to the creating an opening, the multilayer component furtherincludes a thermal barrier coating (TBC) layer extending over the oxidelayer, wherein the method further comprises removing the TBC layer priorto the creating an opening, and wherein the repairing includes repairingthe TBC layer.